In copper plating, a current of 0.5A is allowed for cathode area of 100cm². If this current is maintained constant for 100 minutes, the thickness of the copper deposited will be approximately (the electrochemical equivalent of copper = 0.0003g/°C, density of copper = 10⁴g/cm³ )

10^-2mm

10^-3mm

10^-4mm

10^-5mm

10^-6mm

Correct answer is E

m = Itz

density = $\frac{\text{mass}}{\text{area x thickness}}$

Density = $\frac{Itz}{A \times h}$

$10^4 = \frac{0.5 \times 100 \times 60 \times 0.0003}{100 \times h}$

h = 9 x 10^-7cm = 9 x 10^-6mm

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In copper plating, a current of 0.5A is allowed for cathode area of 100cm². If this current is maintained constant for 100 minutes, the thickness of the copper deposited will be approximately (the electrochemical equivalent of copper = 0.0003g/°C, density of copper = 10⁴g/cm³ )

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In copper plating, a current of 0.5A is allowed for cathode area of 100cm². If this current is maintained constant for 100 minutes, the thickness of the copper deposited will be approximately (the electrochemical equivalent of copper = 0.0003g/°C, density of copper = 104g/cm³ )

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In copper plating, a current of 0.5A is allowed for cathode area of 100cm². If this current is maintained constant for 100 minutes, the thickness of the copper deposited will be approximately (the electrochemical equivalent of copper = 0.0003g/°C, density of copper = 10⁴g/cm³ )